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Norton, Massachusetts, May 9, 2019. CPS Technologies Corporation (Nasdaq:CPSH), a world leader in combining metals and ceramics to improve performance and reliability of applications in a variety of electrical system applications, is pleased to announce our 12th consecutive year of exhibiting at the Electronic Components and Technology Conference (ECTC) on May 28 – 31, 2019.

ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the International Institute of Electrical and Electronics Engineers (IEEE) Packaging Society.

This year, ECTC is being held at The Cosmopolitan of Las Vegas in Las Vegas, NV. CPS technical sales specialists will be hosting Booth #407. Let our specialists help you solve your toughest thermal challenges with our advanced materials solutions.

About CPS Technologies Corporation:

CPS is a global leader in producing metal-matrix composite components used to improve the reliability and performance of various electrical systems. CPS products are used in motor controllers for hybrid and electric vehicles, high-speed trains, subway cars and wind turbines, as well as heat spreaders in internet switches, routers and high-performance microprocessors. CPS HybridTech Armor® products are also used to defeat the most advanced threats to ground, airborne and naval platforms.

Joe Englin
Director of Business Development
Mr. Englin joined CPS in April of 2023. Prior to joining CPS, his work experience includes positions in business development, with a focus on composite materials and aerospace markets. Mr. Englin received a BSE in mechanical engineering from Calvin University and an MSE in Engineering Management and Leadership.